Product Packaging Engineer
Intel CorporationPhoenix, Arizona, United States
Posted April 10, 2026
141910 - 200340 USD
Full Time
About the Company
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
Job Description
As a Product Packaging Engineer, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products globally.
Requirements
- Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.
- Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.
- Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure packaging solutions meet operational needs.
- Identify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
- Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.
- Consult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.
- Evaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.
- Benchmark packaging designs and processes against industry standards to maintain a competitive edge.
- Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.
Benefits
- Health
- Retirement
- Vacation
- Stock bonuses