Packaging and Assembly lead

We are seeking an experienced process lead/Manager in the field of optical sensor device packaging and contract manufacture with a degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics or a related field. The role involves leading NPI process team, communicating with RnD team, working with wafer foundries and OSATs, and providing technical inputs for device tapeout design and device packaging.

Requirements

• Master or Ph.D. degree with 8 years of relevant experience
• Experience with process integration for process flow design and continue process improvement
• Former experience of microelectronic and optical devices packaging
• Project management capability/experience
• Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement
• Experience with FMEA, failure analysis, and 8D report
• Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams
• Fast learner
• Good work ethics
• Capable of keeping company confidential information and IP

Benefits

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team