Lyte AI is seeking an experienced process lead engineer in the field of optical device packaging and assembly to lead optical engine and system module assembly, support device packaging RnD and NPI, and work with RnD to understand device specs and negotiate between device MCO, mechanical design, and assembly process.
Requirements
- Mechanical engineer degree with relevant experience on optical module and/or Lider assembly
- Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience
- Experience or knowledge of optical sensors, optical device packaging process, or optical module assembly process
- Experience with assembly process integration for process flow design and continue process improvement
- Expertise in mechanical drawings using SolidWork, mechanical simulation, and thermal simulation
- Project management capability/experience
- Experience working with foundries, OSATs, assembly houses, PCBA fab, and contract manufacturers in process development and yield improvement
Benefits
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment