Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Join Micron's inclusive team to use expertise in relentless pursuit of innovation for customers and partners. Develop and optimize assembly processes for advanced packaging technologies, ensure defense coverage, and work closely with internal and external stakeholders to build technology development strategies.

Requirements

• Process Development: Develop and optimize assembly processes for advanced packaging technologies
• Evaluate and promote new equipment and materials to enhance process capabilities
• Ensure defense coverage through process, measurement, inspection, and testing
• Collaborate with internal and external stakeholders to build and execute technology development strategies

Benefits

• Competitive salary
• Medical and dental insurance
• Retirement savings plan
• Paid time off and holidays