Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron TechnologySingapore, Singapore
Posted February 25, 2026
Full Time
About the Company
Micron Technology is a leading provider of high-performance memory and storage solutions, including DRAM, NAND, NOR flash, SSDs, and hybrid memory cubes. With a focus on innovation and operational excellence, Micron serves the data center, intelligent edge, and client markets, enabling advancements in AI and compute-intensive applications. The company's commitment to technology leadership and customer-centric approach positions it as a key player in the semiconductor industry.
Job Description
Join an inclusive team passionate about using their expertise in the relentless pursuit of innovation for customers and partners. Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
Requirements
- Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
- Evaluate and promote new equipment and materials to enhance process capabilities
- Ensure defense coverage through process, measurement, inspection, and testing