Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron TechnologySingapore, Singapore
Posted September 29, 2025
Full Time
About the Company
Micron is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
Job Description
Join Micron's inclusive team in Singapore to develop and enable deployment of assembly processes for advanced packaging technologies. Work with peers and partners to coordinate technology development and launch of new technologies and integration flows for solutions that drive the future.
Requirements
- Develop and optimize assembly processes for advanced packaging technologies
- Evaluate and promote new equipment and materials to enhance process capabilities
- Ensure defense coverage through process, measurement, inspection, and testing
Benefits
- Competitive salary and benefits package
- Opportunities for professional growth and development
- Collaborative and inclusive work environment