Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron TechnologySingapore
Posted September 29, 2025
Full Time
About the Company
Micron Technology, Inc. is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
Job Description
Join a world-class global team focused on using expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. Develop and enable deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Benefits
- Competitive salary
- Comprehensive benefits package
- Stock options
- Flexible working hours
- Employee assistance program