Front End Central Product Integration - Chip Interaction Senior Engineer/Engineer
Micron TechnologySingapore, Singapore
Posted December 10, 2025
Full Time
About the Company
Micron Technology is a leading provider of high-performance memory and storage solutions, including DRAM, NAND, NOR flash, SSDs, and hybrid memory cubes. With a focus on innovation and operational excellence, Micron serves the data center, intelligent edge, and client markets, enabling advancements in AI and compute-intensive applications. The company's commitment to technology leadership and customer-centric approach positions it as a key player in the semiconductor industry.
Job Description
Join Micron Technology, Inc. as a Front End Central Product Integration Engineer-Chip Package Interaction and contribute to driving innovation for customers and partners. Responsibilities include promoting worldwide synergy, defining strategies for packaging technology and interaction with front-end manufacturing process, and leading a taskforce to address yield and quality challenges.
Requirements
- Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field
- A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration
- Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield
Benefits
- Competitive salary
- Health insurance
- Retirement plan
- Stock options
- Paid time off