Package Reliability Engineer/Senior Package Reliability Engineer

Micron Technology is seeking a Package Reliability Engineer/Senior Package Reliability Engineer to coordinate package quality and reliability efforts for one of Micron's product lines. The ideal candidate will have a strong understanding of semiconductor component package assembly processes, mechanical and material interaction effects on reliability, and industry standard reliability test methods.

Requirements

• Detailed knowledge of semiconductor component package assembly processes and challenges
• Knowledge of surface mount
• Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
• Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability
• Knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred
• Self-motivated, able to work independently, and detail oriented
• Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
• Good written and verbal communication skills
• Strong understanding on software systems employed in backend manufacturing is a plus

Benefits

• Competitive salary
• Benefits package
• Opportunities for growth and development