Senior Engineer, Advanced Packaging Integration Engineering

Join an inclusive team passionate about innovation, working on advanced packaging integration engineering for memory and compute technologies. Develop and enable advanced package technology, improve product quality, and enhance productivity.

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
• 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
• Experience with Visual Basic for automation and tool integration
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
• Ability to resolve complex issues through root-cause or model-based problem solving
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes

Benefits

• Competitive salary and benefits package
• Opportunities for career growth and development
• Collaborative and inclusive team environment
• Recognition and rewards for outstanding performance