Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team!

Requirements

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Integrate semiconductors while partnering with process and product engineering teams
• Achieve and improve yields through silicon package integration innovation
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives