Principal Physical Design Architect, HBM

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. As an HBM Design Architect, you will support the development of advanced analog, mixed‐signal, and digital circuits as well as full‐chip integration for next‐generation High Bandwidth Memory (HBM) products.

Requirements

• Develop floorplans that optimize circuit placement, routing efficiency, and power delivery networks.
• Deliver block‐level analog or mixed‐signal layouts using advanced foundry process technologies.
• Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies.
• Evaluate timing, area, power, and complexity trade-offs for high‐speed DRAM and mixed‐signal circuits.
• Support integration of Memory, Logic, and Analog circuits for new HBM product architectures.
• Ensure alignment with developed rules, manufacturability requirements, and physical verification constraints.
• Provide design-focused insights to improve circuit robustness, performance, and reliability.
• Participate in reviews and fixing issues across physical build, parasitic extraction, and full‐chip integration.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays