Principal Physical Design Architect, HBM

Micron Technology is seeking a Principal Physical Design Architect to support the development of advanced analog, mixed-signal, and digital circuits for next-generation High Bandwidth Memory (HBM) products. The ideal candidate will have expertise in physical design and layout, including creating optimized floorplans, driving circuit placement and routing strategies, and delivering high-quality block-level layouts using advanced process nodes.

Requirements

• Develop floorplans that optimize circuit placement, routing efficiency, and power delivery networks
• Deliver block-level analog or mixed-signal layouts using advanced foundry process technologies
• Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies
• Evaluate timing, area, power, and complexity trade-offs for high-speed DRAM and mixed-signal circuits
• Support integration of Memory, Logic, and Analog circuits for new HBM product architectures
• Ensure alignment with developed rules, manufacturability requirements, and physical verification constraints
• Provide design-focused insights to improve circuit robustness, performance, and reliability
• Participate in reviews and fixing issues across physical build, parasitic extraction, and full-chip integration

Benefits

• Choice of medical, dental, and vision plans
• Paid family leave
• Paid time-off program
• Paid holidays