Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
Micron TechnologySingapore, Singapore
Posted September 29, 2025
Full Time
About the Company
Industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all
Job Description
Join Micron’s Advanced Packaging Technology Development (APTD) team as a Principal/Senior Engineer to develop and enable deployment of post-fab wafer finishing processes for high-performance memory products.
Requirements
- Develop and enable deployment of processes related to the post-fab wafer finishing processes
- Work with peers and partners to coordinate the development and launch of new technologies and integration flows
- Establish and improve process management projects to deliver technology node requirements and scaling
Benefits
- Competitive salary
- Comprehensive benefits package
- Opportunities for career growth and development