Principal/Sr Engineer, Advance Packaging Process Engineering

Join Micron Technology, a world leader in innovating memory and storage solutions, as a Principal/Sr Engineer in the Process Development team. Develop, configure, and optimize Package Assembly processes for Micron's memory. Work with Manufacturing teams to optimize advance packaging process and drive innovation.

Requirements

• Developing, configuring, and optimizing Package Assembly processes
• Assessing processes, taking measurements, and interpreting data
• Involved in design approvals, running, testing, and upgrading systems and processes
• Path finding of innovative package technology
• Hands-on integration experience in Package Assembly and Wafer Level package process

Benefits

• Generous Paid Time Off
• 401k Matching
• Retirement Plan
• Visa Sponsorship
• Four Day Work Week
• Generous Parental Leave
• Tuition Reimbursement
• Relocation Assistance