Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Join our inclusive team passionate about using expertise in the relentless pursuit of innovation for customers and partners. Develop and enable advanced package technology for high performance memory products and transfer to manufacturing.

Requirements

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Improve product quality, drive yield improvements, reduce costs, and enhance productivity
• Integrate semiconductors while partnering with process and product engineering teams
• Achieve and improve yields through silicon package integration innovation
• Collect and analyze data to provide actionable outcomes and decisions
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Benefits

• Health insurance
• Dental insurance
• Vision insurance
• Paid time off
• Retirement plan
• 401(k) matching
• Life insurance
• Disability insurance
• Paid holidays