Advanced Packaging Technologist

We are seeking an experienced engineer to lead the development of advanced packaging technologies that enable next-generation, high-performance compute systems. This role sits at the intersection of chip architecture, package integration, and manufacturing scale-up, driving breakthroughs in performance, power, thermal, and reliability.

Requirements

• Architect, develop, and prototype advanced packaging solutions
• Develop packaging concepts and requirements to support CPO packaging
• Lead large-reticle and multi-die integration strategies
• Identify and solve fundamental technical challenges in package architecture, integration, and manufacturability

Benefits

• Competitive salary
• Comprehensive benefits package
• Opportunity to work on cutting-edge AI technology
• Collaborative and innovative work environment