Technical Fellow, Advanced Packaging Integration

TechInsights is a leading provider of semiconductor industry intelligence. As a Technical Fellow, Advanced Packaging Integration, you'll lead technical direction in advanced packaging and HPC product areas, connecting device-level architecture to system-level performance. This is a rare opportunity to shape the technical direction of TechInsights and contribute to next-generation compute analysis across the data center ecosystem.

Requirements

• A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.
• Master’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, Applied Physics, or equivalent field experience.
• Adept at connecting materials, process, and architecture to system-level performance in HPC or networking applications.
• Deeply familiar with one or more of the following domains: Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives).
• Processor and chiplet architecture (CPU, GPU, DPU, TPU, FPGA, ASIC).
• System-level power, thermal, and performance analysis.
• Demonstrated success applying AI and automation tools to accelerate technical content or workflow efficiency.
• An effective communicator and storyteller comfortable engaging with engineers, executives, and customers alike.

Benefits

• Company-sponsored training and development opportunities
• Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement)
• Flexible vacation policy
• Bring your own device program
• Community involvement opportunities through charitable alliances
• Wellness resources and support
• Inclusive environment that prioritizes diversity, equity, and accessibility