Staff Package Development Engineer

Responsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints, developing new assembly technologies, defining package design rules, process flow and material set for new products, and collaborating with multi-functional teams for successful development, qualification and production ramp of new module products.

Requirements

• BS Degree in ECE, EE, ME, ChemE, CompE, Material Science
• 15 years of experience in Semiconductor Assembly as Process Engineer, Process Development Engineer & Package Development Engineer
• Excellent people & leadership skills and experience in dealing with & managing OSATs for at least 5 years
• Substantial experience in Power Discrete Products with Multi Die & Stacked Die configuration, Ag Sintered Die Bonding, Al, Cu/PCC & Au Wirebonding Technologies and Low Stress Vacuum Molding
• Ability to perform actual hands on Process Capability Analysis & Risk Prediction, Design of Experiments, Variability Charting, Analysis of Variance/Means Comparison/T-Tests from raw data using SAS.JMP or Mini Tab Software
• Experience with latest material technologies : Sapphire Substrate Sawing, Conductive & Non Conductive High Thermal Die Attach Film, Ag Sintered Epoxies, Clip Bonding, Ribbon Wire Bonding, High CTI, High Thermal, High Tg, Low Stress, Fine filler Molding Compounds
• Knowledge of AECQ Automotive reliability requirements, APQP automotive development process, JEDEC Design standards
• Ability to work in a fast-paced, high stress environment with high rates of change
• Able to work with people in the US & Europe timezones