Semiconductor Packaging Engineer

Semiconductor Packaging Engineer responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. Supports design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems.

Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience
• Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments
• Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
• Hands-on experience working with semiconductor assembly and packaging equipment
• Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
• Experience collaborating across research and development, hardware engineering, and manufacturing teams
• Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
• Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies

Benefits

• 401(k) with up to 4% company match
• Quarterly bonus program
• 15-days of accrued PTO
• 9 company paid holidays
• Multiple options for medical insurance and dental insurance
• Voluntary benefits: vision, long-term disability, and life insurance