Packaging Module Development Engineer

Packaging Module Development Engineer develops assembly processes and equipment for Intel's future assembly packaging platform technologies. Requires onsite presence and experience in semiconductor fabrication processes and technologies.

Requirements

• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field
• 3+ years of experience in semiconductor fabrication processes and technologies
• Programming/script skills (e.g., Python, MATLAB)
• Experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Familiarity with artificial intelligence and machine learning concepts

Benefits

• Competitive pay
• Stock bonuses
• Health benefit programs
• Retirement benefit programs
• Vacation benefit programs