Packaging Module Equipment Development Engineer

Develops assembly processes and equipment to support Intel's future assembly packaging platform technologies, optimizes manufacturing processes, and leads technical problem-solving and process improvement initiatives.

Requirements

• Bachelor's degree in Engineering, Physics, Chemistry, Materials Science, or a related technical field
• 5+ years of engineering industry experience, including inspection equipment
• Experience with automated inspection tools, image processing algorithms, and artificial intelligence
• Semiconductor fabrication processes and technology experience
• Advanced packaging and/or assembly process experience
• Project management experience delivering results for complex, time-critical technical projects

Benefits

• Total compensation package that ranks among the best in the industry
• Competitive pay
• Stock bonuses
• Health benefit programs
• Retirement benefit programs
• Vacation benefit programs