Packaging Module Equipment Development Engineer

Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies. Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.

Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, or a related engineering or science discipline
• 5+ years of engineering industry experience
• Experience in semiconductor manufacturing and/or advanced packaging technologies
• Experience with packaging process development, assembly equipment, or manufacturing optimization
• Knowledge of reliability testing, failure analysis, and process qualification methods
• Experience working in high-volume manufacturing or technology development environments
• Strong collaboration and communication skills with cross-functional teams and external suppliers

Benefits

• Competitive pay
• Stock bonuses
• Health benefit programs
• Retirement benefit programs
• Vacation benefit programs