Packaging Module Development Engineer

Join Intel's team as a Packaging Module Development Engineer to drive innovation in semiconductor packaging and contribute to the development of next-generation assembly and packaging platform technologies.

Requirements

• Design and develop assembly processes and equipment to enable future packaging technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
• Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
• Oversee the manufacturability of package designs and manage their manufacturing cycles.
• Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
• Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
• Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
• Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
• Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.

Benefits

• competitive pay
• stock bonuses
• health
• retirement
• vacation