Packaging Module Development Engineer

Role Overview

The Packaging Module Development Engineer will contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. The role will collaborate with multifunctional, cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. The ideal candidate will demonstrate technical leadership, strategic planning, and critical thinking.

What You Will Do

The Packaging Module Development Engineer will drive innovation in next-generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities. The role will lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high-volume manufacturing.

Why It Might Be a Fit

The ideal candidate will have technical leadership, strategic planning, and critical thinking skills. They will also have the ability to coach and develop technical teams, tolerance for ambiguity and adaptability in a dynamic environment, flexibility in managing changing priorities and responsibilities, experience leading teams in a highly matrixed organization, initiative and ability to work independently, and strong communication, influencing, technical, and analytical skills.

Requirements

• Master's degree in engineering, physics, chemistry or related STEM field
• 3+ years of industry experience or PhD with one or more years in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field
• Minimum cumulative GPA of 3.5
• Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts

Benefits

• Competitive pay
• Stock
• Bonuses
• Health benefits
• Retirement benefits
• Vacation time