Packaging Module Development Engineer

Join Intel’s Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions.

Requirements

• Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
• Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
• Design and execute experiments to validate packaging technologies under environmental stress conditions
• Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions
• Define equipment specifications and partner with vendors to meet technical and performance requirements
• Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques
• Lead technical problem-solving efforts and contribute to process innovation initiatives
• Document findings and best practices through technical reports and knowledge-sharing forums
• Support standardization of qualification processes, quality systems, and engineering methodologies

Benefits

• Generous Paid Time Off
• 401k Matching
• Retirement Plan
• Health benefits
• Vacation benefits