Advanced Package Layout Engineer

Role Overview

The Marvell - Central Engineering Packaging organization drives semiconductor IC package development from concept to mass production. The team is responsible for supporting customers with advanced custom package designs that meet challenging electrical requirements.

What You Will Do

Evaluating design feasibility, hands-on physical implementation of the package design, close interaction with electrical simulation team, and other layout related tasks.

Why It Might Be a Fit

Familiarity with IC package or PCB layout tools, packaging technologies, materials, and advanced 2.5D/3D package technology.

Requirements

• Bachelor’s degree in Electrical Engineering
• 3 - 5 years of related professional experience
• Familiarity with IC package or PCB layout tools like Cadence APD, Xpedition Package Designer
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Understanding of advanced 2.5D/3D package technology
• Good English (spoken and written)
• Able to organize their work to meet specific milestones
• Able to work and collaborate in team

Benefits

• Competitive compensation
• Great benefits
• Workstyle within an environment of shared collaboration, transparency, and inclusivity