Lead Engineer, Package Development & Engineering
Micron TechnologySingapore, Singapore
Posted January 16, 2026
Full Time
About the Company
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
Job Description
Join an inclusive team passionate about innovation and use expertise to enrich life for all. Provide technical leadership and strategic oversight for advanced packaging initiatives.
Requirements
- Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline
- 8+ years of experience in semiconductor packaging, process integration, or technology development
- Proven ability to lead complex, cross-functional technical programs in a high-tech environment
- Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration