Principal/Sr Engineer, Advance Packaging Process Engineering

Join an inclusive team passionate about using their expertise in the relentless pursuit of innovation for customers and partners. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.

Requirements

• Developing, configuring and optimizing Package Assembly processes for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams.
• Assessing processes by knowledge and skills, taking measurements and interpreting data
• Assembly design rules development working side by side with Design teams (Globally)
• Involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).
• Path finding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies.
• Hands-on integration experience in Package Assembly and Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

Benefits

• Paid Time Off
• Retirement Plan
• Visa Sponsorship
• Medical, Dental and Vision Insurance
• 401(k) Matching
• Stock Options