Lead Engineer - Package Development & Engineering
Micron TechnologySingapore, Singapore
Posted January 16, 2026
Full Time
About the Company
Micron is an industry leader in innovative memory and storage solutions.
Job Description
Join an inclusive team passionate about innovation for customers and partners, leading strategic project initiatives across the Advanced Packaging & Technology Development organization.
Requirements
- Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field
- 8+ years of experience in semiconductor packaging, process integration, or technology development
- Proven track record in managing complex, cross-functional projects in a high-tech environment