Principal Physical Design Engineer, HBM

Micron Technology is seeking a Principal Physical Design Engineer to lead end-to-end physical design for High Bandwidth Memory (HBM) base and memory dies. The ideal candidate will have 12+ years of experience in advanced-node physical design and proven tape-out experience in HBM, DRAM, or large memory-centric designs.

Requirements

• Bachelor’s degree or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
• 12+ years of hands-on experience in advanced-node physical design
• Expert-level experience with Cadence Innovus and/or Synopsys ICC2 or Fusion Compiler

Benefits

• Medical, dental, and vision plans
• Paid family leave
• Paid time-off program
• Paid holidays