Principal Physical Design Engineer, HBM

Micron Technology is seeking a Principal Physical Design Engineer to lead end-to-end physical design for High Bandwidth Memory (HBM) base and memory dies. The successful candidate will have 12+ years of experience in advanced-node physical design and proven tape-out experience in HBM, DRAM, or large memory-centric designs.

Requirements

• Bachelor’s degree or Master’s degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent professional experience
• 12+ years of hands-on experience in advanced-node physical design with proven tape-out experience in HBM, dynamic random-access memory (DRAM), or large memory-centric designs
• Deep expertise in floorplanning, hierarchical physical design, timing closure, static timing analysis, power integrity (IR/EM), thermal analysis, and physical signoff
• Expert-level experience with Cadence Innovus and/or Synopsys ICC2 or Fusion Compiler, plus experience with Voltus, RedHawk, or equivalent power integrity tools
• Familiarity with Calibre design rule checking, layout versus schematic, and advanced foundry signoff flows

Benefits

• Choice of medical, dental, and vision plans
• Benefit programs that help protect income if unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays